Research Process in Plasma Spray Physical Vapor Deposited Thermal Barrier Coatings

Abstract

Plasma spray physical vapor deposition (PS-PVD) is a newly developed processing technology for advanced functional coatings and films. PS-PVD is featured with the advantages of plasma spray (PS) and physical vapor deposition (PVD) and can be used for high efficient co-deposition of vapor phases, liquid droplets and solid particles, with the capability of highly flexibility in building up various microstructure architectures. Besides, uniform deposition of the coatings or films can be achieved by this technology even on the non-line-of-sight areas of those components with complex geometry. Owing to the above merits, PS-PVD shows very promising potential in the fields of thermal barrier coatings (TBCs), environmental barrier coatings (EBCs), super-hard and wear-resistant coatings or films, oxygen permeable membranes and electrode membranes. Further, PS-PVD is recognized as the processing technology for advanced TBCs in the future. In this paper, physical principles and recent research progress in preparation and deposition mechanisms of PS-PVD TBCs are briefly introduced and summarized. The future development trends of PS-PVD in new thermal barrier coatings are prospected.

Keywords

• PS-PVD
• thermal barrier coatings (TBCs)
• processing
• deposition mechanisms