Study of heat transfer performance of miniature heat sink for integrated circuit packaging field

Abstract

The miniature heat sink is an essential component in integrated circuit packaging, playing a vital role in ensuring the stable and reliable performance of integrated circuits. In this paper, we establish a simulation model of the heat transfer performance of a miniature heat sink with a square columnar array microstructure and study the effect of the dimensional parameters of the miniature heat sink on the heat transfer performance. Then, the mathematical equations between the heat source temperature and the dimensional parameters of the miniature heat sink are obtained based on the response surface method, and the dimensional parameters are optimized. Finally, wire electrical discharge machining (WEDM) was used to prepare miniature heat sinks and to test the heat transfer performance. The experimental results show that both the simulation model and the mathematical equations have high accuracy, and the heat source temperature of the miniature heat sink with column width, column distance, and column height of 364 μm, 331 μm, and 1500 μm, respectively, can be reduced to 101.8 °C, which is 93.5 °C lower than the heat source temperature of 195.3 °C without heat sink, and the temperature reduction reaches 47.9%. The miniature heat sink has a simple manufacturing process, low manufacturing cost, small overall size, and good heat transfer performance, which has a broad application prospect in the field of integrated circuit packaging.

Keywords

• Integrated circuit
• Miniature heat sink
• WEDM
• Heat transfer performance
• Microstructure