Nature Communications (Sep 2024)
Wearable bio-adhesive metal detector array (BioMDA) for spinal implants
- Jian Li,
- Shengxin Jia,
- Dengfeng Li,
- Lung Chow,
- Qiang Zhang,
- Yiyuan Yang,
- Xiao Bai,
- Qingao Qu,
- Yuyu Gao,
- Zhiyuan Li,
- Zongze Li,
- Rui Shi,
- Binbin Zhang,
- Ya Huang,
- Xinyu Pan,
- Yue Hu,
- Zhan Gao,
- Jingkun Zhou,
- WooYoung Park,
- Xingcan Huang,
- Hongwei Chu,
- Zhenlin Chen,
- Hu Li,
- Pengcheng Wu,
- Guangyao Zhao,
- Kuanming Yao,
- Muhamed Hadzipasic,
- Joshua D. Bernstock,
- Ganesh M. Shankar,
- Kewang Nan,
- Xinge Yu,
- Giovanni Traverso
Affiliations
- Jian Li
- Department of Biomedical Engineering, City University of Hong Kong
- Shengxin Jia
- Department of Biomedical Engineering, City University of Hong Kong
- Dengfeng Li
- Department of Biomedical Engineering, City University of Hong Kong
- Lung Chow
- Department of Biomedical Engineering, City University of Hong Kong
- Qiang Zhang
- Department of Biomedical Engineering, City University of Hong Kong
- Yiyuan Yang
- Department of Mechanical Engineering, Massachusetts Institute of Technology
- Xiao Bai
- Department of Biomedical Engineering, City University of Hong Kong
- Qingao Qu
- Department of Biomedical Engineering, City University of Hong Kong
- Yuyu Gao
- Department of Biomedical Engineering, City University of Hong Kong
- Zhiyuan Li
- Department of Biomedical Engineering, City University of Hong Kong
- Zongze Li
- Department of Biomedical Engineering, City University of Hong Kong
- Rui Shi
- Department of Biomedical Engineering, City University of Hong Kong
- Binbin Zhang
- Department of Biomedical Engineering, City University of Hong Kong
- Ya Huang
- Department of Biomedical Engineering, City University of Hong Kong
- Xinyu Pan
- Department of Biomedical Engineering, City University of Hong Kong
- Yue Hu
- Department of Biomedical Engineering, City University of Hong Kong
- Zhan Gao
- Department of Biomedical Engineering, City University of Hong Kong
- Jingkun Zhou
- Department of Biomedical Engineering, City University of Hong Kong
- WooYoung Park
- Department of Biomedical Engineering, City University of Hong Kong
- Xingcan Huang
- Department of Biomedical Engineering, City University of Hong Kong
- Hongwei Chu
- Department of Biomedical Engineering, City University of Hong Kong
- Zhenlin Chen
- Department of Biomedical Engineering, City University of Hong Kong
- Hu Li
- Department of Biomedical Engineering, City University of Hong Kong
- Pengcheng Wu
- Department of Biomedical Engineering, City University of Hong Kong
- Guangyao Zhao
- Department of Biomedical Engineering, City University of Hong Kong
- Kuanming Yao
- Department of Biomedical Engineering, City University of Hong Kong
- Muhamed Hadzipasic
- Department of Neurosurgery, Massachusetts General Hospital, Harvard Medical School Boston
- Joshua D. Bernstock
- Department of Neurosurgery, Brigham and Women’s Hospital, Harvard Medical School
- Ganesh M. Shankar
- Department of Neurosurgery, Massachusetts General Hospital, Harvard Medical School Boston
- Kewang Nan
- College of Pharmaceutical Sciences, Zhejiang University
- Xinge Yu
- Department of Biomedical Engineering, City University of Hong Kong
- Giovanni Traverso
- Department of Mechanical Engineering, Massachusetts Institute of Technology
- DOI
- https://doi.org/10.1038/s41467-024-51987-2
- Journal volume & issue
-
Vol. 15,
no. 1
pp. 1 – 12
Abstract
Abstract Dynamic tracking of spinal instrumentation could facilitate real-time evaluation of hardware integrity and in so doing alert patients/clinicians of potential failure(s). Critically, no method yet exists to continually monitor the integrity of spinal hardware and by proxy the process of spinal arthrodesis; as such hardware failures are often not appreciated until clinical symptoms manifest. Accordingly, herein, we report on the development and engineering of a bio-adhesive metal detector array (BioMDA), a potential wearable solution for real-time, non-invasive positional analyses of osseous implants within the spine. The electromagnetic coupling mechanism and intimate interfacial adhesion enable the precise sensing of the metallic implants position without the use of radiation. The customized decoupling models developed facilitate the precise determination of the horizontal and vertical positions of the implants with incredible levels of accuracy (e.g., <0.5 mm). These data support the potential use of BioMDA in real-time/dynamic postoperative monitoring of spinal implants.
