Prediction and Effect Verification of Thiamine as a Leveling Agent in Chip Wafer Electroplating

• Hu Wei,
• Tong Tan,
• Renlong Liu,
• Lanfeng Guo,
• Changyuan Tao,
• Xiang Qin

Affiliations

Hu Wei

College of Chemistry and Chemical Engineering, Chongqing University, Chongqing, China

Tong Tan

College of Chemistry and Chemical Engineering, Chongqing University, Chongqing, China

Renlong Liu

College of Chemistry and Chemical Engineering, Chongqing University, Chongqing, China

Lanfeng Guo

College of Chemistry and Chemical Engineering, Chongqing University, Chongqing, China

Changyuan Tao

College of Chemistry and Chemical Engineering, Chongqing University, Chongqing, China

Xiang Qin

Hubei Xingfu Electronic Materials Co., Ltd, Yichang, China