Development of Biodegradable Polymeric Films Added with CuO-NPS and Evaluation of Their Antifungal Activity

Abstract

This research was aimed to obtain biodegradable polymeric films with antifungal action against Aspergillus niger, through the addition of copper oxide nanoparticles (CuO-NPs) in the commercial polymer (Ecoflex®) and to evaluate its mechanical, morphological, biodegradation, and copper release properties. The microbiological results showed that the films with 4 wt% CuO-NPs inhibited 97.57% the growth of the fungus growth of 1×105 spores·mL-1 compared to the control. The morphological characterization revealed that the CuO-NPs presented irregular form with particles size of 50 to 400 nm and the XRD showed characteristic peaks of copper oxide. The addition of CuO-NPs to Ecoflex® provided increased maximum and rupture tension, strain, and elasticity modulus the obtained films with 1 wt% CuO-NPs and did not alter the biodegradability of the films. It can be said that, through the addition of CuO-NPs to Ecoflex®, it was possible to add antifungal activity for Aspergillus niger without compromising its biodegradability, meeting the safety standards established by legislation regarding the release of copper.

Keywords

• CuO-NPs
• Ecoflex®
• antimicrobial activity
• antimicrobial packaging