Sensors (Apr 2024)

Nanoscale Three-Dimensional Imaging of Integrated Circuits Using a Scanning Electron Microscope and Transition-Edge Sensor Spectrometer

  • Nathan Nakamura,
  • Paul Szypryt,
  • Amber L. Dagel,
  • Bradley K. Alpert,
  • Douglas A. Bennett,
  • William Bertrand Doriese,
  • Malcolm Durkin,
  • Joseph W. Fowler,
  • Dylan T. Fox,
  • Johnathon D. Gard,
  • Ryan N. Goodner,
  • James Zachariah Harris,
  • Gene C. Hilton,
  • Edward S. Jimenez,
  • Burke L. Kernen,
  • Kurt W. Larson,
  • Zachary H. Levine,
  • Daniel McArthur,
  • Kelsey M. Morgan,
  • Galen C. O’Neil,
  • Nathan J. Ortiz,
  • Christine G. Pappas,
  • Carl D. Reintsema,
  • Daniel R. Schmidt,
  • Peter A. Schultz,
  • Kyle R. Thompson,
  • Joel N. Ullom,
  • Leila Vale,
  • Courtenay T. Vaughan,
  • Christopher Walker,
  • Joel C. Weber,
  • Jason W. Wheeler,
  • Daniel S. Swetz

DOI
https://doi.org/10.3390/s24092890
Journal volume & issue
Vol. 24, no. 9
p. 2890

Abstract

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X-ray nanotomography is a powerful tool for the characterization of nanoscale materials and structures, but it is difficult to implement due to the competing requirements of X-ray flux and spot size. Due to this constraint, state-of-the-art nanotomography is predominantly performed at large synchrotron facilities. We present a laboratory-scale nanotomography instrument that achieves nanoscale spatial resolution while addressing the limitations of conventional tomography tools. The instrument combines the electron beam of a scanning electron microscope (SEM) with the precise, broadband X-ray detection of a superconducting transition-edge sensor (TES) microcalorimeter. The electron beam generates a highly focused X-ray spot on a metal target held micrometers away from the sample of interest, while the TES spectrometer isolates target photons with a high signal-to-noise ratio. This combination of a focused X-ray spot, energy-resolved X-ray detection, and unique system geometry enables nanoscale, element-specific X-ray imaging in a compact footprint. The proof of concept for this approach to X-ray nanotomography is demonstrated by imaging 160 nm features in three dimensions in six layers of a Cu-SiO2 integrated circuit, and a path toward finer resolution and enhanced imaging capabilities is discussed.

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