Tear-and-Interconnect Domain Decomposition Scheme for Solving Multiscale Composite Penetrable Objects

Abstract

In this work, the tear-and-interconnect (T&I) surface-integral-equation (SIE) domain-decomposition (DD) approach-previously developed for non-penetrable bodies-, is extended to composite piecewise homogeneous penetrable objects including multiple materials and multiscale features. The main advantage of the proposed T&I scheme, with respect to conventional DD approach, is that it obviates the definition of large artificial surfaces (required for splitting the volumetric regions) with additional redundant unknowns, which avoids a significant increase in the computational cost, especially when dealing with large volumetric regions. In this sense, it has been shown that the T&I approach is an efficient and accurate alternative, which besides complements the conventional DD approach, since both are compatible and can be easily combined, which gives the possibility of applying one or the other as appropriate, depending on the specific characteristics of the problems to be solved in each case.

Keywords

• Dielectrics
• domain decomposition (DD)
• fast solvers
• surface integral equations (SIE)
• Maxwell’s equations
• method of moments (MoM)