Modeling of temperature processes in orthotropic boards of radio-electronic devices

Abstract

The design of electronic equipment that is resistant to external influences is a topical problem. The arrangement of individual circuit parts is modeled in the form of an orthotropic plate. The paper describes the solutions of homogeneous and inhomogeneous thermal conductivity equation for an orthotropic rectangular plate, obtained by the recurrence-operator method. Numerical results are given for two cases of temperature distribution, satisfying zero boundary conditions, during cooling and heating and given initial conditions.