Plasmonic-based electrochromic materials and devices
Liu Yuwei,
Huang Lin,
Cao Sheng,
Chen Jingwei,
Zou Binsuo,
Li Haizeng
Affiliations
Liu Yuwei
School of Physical Science and Technology, State Key Laboratory of Featured Metal Materials and Life-cycle Safety for Composite Structures, Guangxi University, Nanning, 530004, China
Huang Lin
School of Physical Science and Technology, State Key Laboratory of Featured Metal Materials and Life-cycle Safety for Composite Structures, Guangxi University, Nanning, 530004, China
Cao Sheng
School of Physical Science and Technology, State Key Laboratory of Featured Metal Materials and Life-cycle Safety for Composite Structures, Guangxi University, Nanning, 530004, China
Chen Jingwei
School of Materials Science and Engineering, Ocean University of China, Qingdao, Shandong, 266404China
Zou Binsuo
School of Physical Science and Technology, State Key Laboratory of Featured Metal Materials and Life-cycle Safety for Composite Structures, Guangxi University, Nanning, 530004, China
Li Haizeng
Optics and Thermal Radiation Research Center, Institute of Frontier & Interdisciplinary Science, Shandong University, Qingdao, Shandong, 266237China
The development of electrochromic (EC) materials has paved the way for a wide range of devices, such as smart windows, color displays, optical filters, wearable camouflages, among others. However, the advancement of electrochromism faces a significant hurdle due to its poor stability and limited color options. This lack of stability is primarily attributed to the substantial alteration in the dielectric properties of EC materials during cycling. Consequently, the design of advanced plasmonic materials is a key strategy to achieve a stable EC device. In this review, we provide an overview of the current state-of-the-art designs of plasmonic-based EC materials and devices. We discuss their working principles, techniques for structure/morphology engineering, doping methods, and crystal phase design. Furthermore, we explore the integration of plasmonic materials with other EC materials to create advanced EC devices. Finally, we outline the challenges that need to be addressed and present an outlook on the development of high-performance EC devices.
