Study of Dissolution Process of Solid Cu in Liquid Al

Abstract

The dissolution process of solid Cu in liquid Al influences the compound quality directly when fabricating the copper cladding aluminum (CCA) composite castings utilizing the casting aluminum method. Dissolution rate of solid Cu is investigated utilizing the method of quenching rapidly. Effects of liquid Al temperature and the contact time between solid Cu and liquid Al on the dissolution rate of Cu are investigated; meanwhile, the dissolution mechanism of Cu is explored. Subsequently, the influences of processing parameters on the dissolution thickness of Cu are examined. The results indicate that chemical compounds, such as AlCu2, Cu5Al, CuAl2 and Cu2Al3, may form on the contact surface between solid Cu and liquid Al. These chemical compounds are contributed to decompose the solid Cu, Cu5Al exerts the greatest effect. The dissolution of Cu is affected by the contact time between solid Cu and liquid Al, temperature and cooling method of Cu plate. The dissolution of Cu cannot terminate immediately even though the Cu plate is cooled by the spray. The experimental results will provide a reference for controlling the composite layer thickness.

Keywords

• cu/al composite
• dissolution rate
• dissolution mechanism
• processing parameters