Nature Communications (Aug 2020)

High-temperature-resistant silicon-polymer hybrid modulator operating at up to 200 Gbit s−1 for energy-efficient datacentres and harsh-environment applications

  • Guo-Wei Lu,
  • Jianxun Hong,
  • Feng Qiu,
  • Andrew M. Spring,
  • Tsubasa Kashino,
  • Juro Oshima,
  • Masa-aki Ozawa,
  • Hideyuki Nawata,
  • Shiyoshi Yokoyama

DOI
https://doi.org/10.1038/s41467-020-18005-7
Journal volume & issue
Vol. 11, no. 1
pp. 1 – 9

Abstract

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Information and communication datacentres require a large amount of energy for their cooling systems, which could be decreased by working at higher temperatures. Here, the authors introduce a silicon-polymer hybrid modulator that maintains high data rates for long periods at high temperatures that could be used under such conditions, to reduce energy consumption.