AIP Advances (Dec 2012)

Growth of ∼5 cm2V−1s−1 mobility, p-type Copper(I) oxide (Cu2O) films by fast atmospheric atomic layer deposition (AALD) at 225°C and below

  • D. Muñoz-Rojas,
  • M. Jordan,
  • C. Yeoh,
  • A. T. Marin,
  • A. Kursumovic,
  • L. A. Dunlop,
  • D. C. Iza,
  • A. Chen,
  • H. Wang,
  • J. L. MacManus Driscoll

DOI
https://doi.org/10.1063/1.4771681
Journal volume & issue
Vol. 2, no. 4
pp. 042179 – 042179-7

Abstract

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Phase pure, dense Cu2O thin films were grown on glass and polymer substrates at 225°C by rapid atmospheric atomic layer deposition (AALD). Carrier mobilities of 5 cm2V−1s−1 and carrier concentrations of ∼1016 cm−3 were achieved in films of thickness 50 - 120 nm, over a >10 cm2 area. Growth rates were ∼1 nm·min−1 which is two orders of magnitude faster than conventional ALD.. The high mobilities achieved using the atmospheric, low temperature method represent a significant advance for flextronics and flexible solar cells which require growth on plastic substrates.