Electrical discharge machining of semiconductor materials: A review

Abstract

Semiconductor materials including Silicon (Si), Germanium (Ge), Gallium Arsenide (GaAs), and Silicon Carbide (SiC) are difficult to machine due to their high brittleness and low plasticity. Conventional machining methods such as dicing and blade cutting used to cause quality problems such as cracks, poor edges, and blue film damage. Electrical discharge machining (EDM) is an unconventional method in which the primary mechanisms of material removal encompass melting, vaporization, erosion, and crumbling. The utilization of thermal energy generated by controlled electrical pulses to extract material from workpieces has proven to be a highly effective approach in the machining of semiconductor materials. This paper reviewed the state-of-the-art technologies applied in machining semiconductors. The advantages and disadvantages of each method were summarized. The most recent research outcomes were introduced. Thermal physical removal model, material migration, dielectric fluid, and contact potential were discussed. The causes leading to multi-channel discharge phenomenon and the insight into the application of the new machining theories were presented. The latest technologies and future development trend were also discussed.

Keywords

• Semiconductor
• Electrical discharge machining
• EDM
• Wire-EDM
• Multi-channel discharge