Communications Materials (May 2020)

Stable microstructure in a nanocrystalline copper–tantalum alloy during shock loading

  • B. Chad Hornbuckle,
  • Cyril L. Williams,
  • Steven W. Dean,
  • Xuyang Zhou,
  • Chaitanya Kale,
  • Scott A. Turnage,
  • John D. Clayton,
  • Gregory B. Thompson,
  • Anit K. Giri,
  • Kiran N. Solanki,
  • Kristopher A. Darling

DOI
https://doi.org/10.1038/s43246-020-0024-3
Journal volume & issue
Vol. 1, no. 1
pp. 1 – 6

Abstract

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Shock loading of materials alters the microstructure and considerably degrades mechanical performance. Here, shock loading of a nanocrystalline Cu–Ta alloy is found to induce minor changes to microstructure and mechanical performance, attributed to the annihilation of defects during deformation.