A novel method for in situ TEM measurements of adhesion at the diamond–metal interface

Abstract

Abstract The procedure for in situ TEM measurements of bonding strength (adhesion) between diamond and the metal matrix using a Hysitron PI 95 TEM Picoindenter holder for mechanical tests and Push-to-Pull devices was proposed. For tensile tests, dog-bone shaped lamellae 280–330 nm thick and ~ 2.5 µm long were used as objects of study. The lamellae were manufactured using the focused ion beam technology from the metal–diamond interface of diamond-containing composite material with a single-phase binder made of Fe–Co–Ni alloy. The experimentally determined bonding strength was 110 MPa.