Structural Designs of Transparent Polyimide Films with Low Dielectric Properties and Low Water Absorption: A Review

Abstract

The rapid development of communication networks (5G and 6G) that rely on high-speed devices requiring fast and high-quality intra- and inter-terminal signal transmission media has led to a steady increase in the need for high-performance, low-dielectric-constant (Dk) (k, low dielectric loss (Df), and low water absorptivity. PI materials are broadly used in various fields owing to their superior property/processibility combinations. This review summarizes the structural designs of PIs with low Dk and Df values, low water-absorbing capacity, and high optical transparency intended for communication applications. Furthermore, we characterize structure–property relationships for various PI types and finally propose structural modifications required to obtain useful values of the abovementioned parameters.

Keywords

• polyimides
• dielectric properties
• low D_k
• low D_f
• low water absorption
• 5G/6G communication