Hangkong gongcheng jinzhan (Jun 2020)

Application of Topology Optimization Based on sinh Function in the Design of Heat Conduction Structure

  • XUE Hongjun,
  • TAO Caiyong,
  • DANG Sina

DOI
https://doi.org/10.16615/j.cnki.1674-8190.2020.03.011
Journal volume & issue
Vol. 11, no. 3
pp. 370 – 379

Abstract

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The heat conduction structure design of electronic equipment is an effective method to solve the thermal protection problem of aircraft electronic equipment. The experiential-based traditional design method has the problems of long design period, and can't acquire the better results, so the topology optimization applied in thermal design of aircraft electronic device can acquire the fast better structure layout. The heat conduction topology optimization mathematic method based on hyperbolic sine function (sinh function) interpolation model is established. Its algorithm is applied to 2D and 3D heat conduction samples, and realized with MATLAB programming. The model is compared with SIMP model and RAMP model, and applied in conduction topology optimization design of onboard LRM module. The results show that the interpolation model based on sinh function is more accurate than SIMP interpolation model, and has fewer iterations than RAMP interpolation model, and can better solve the problem of topology optimization design of heat conduction structure.

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