ACS Omega
(Mar 2024)
Influence of PUB2 on the Leveling Effect of Chip Copper Connection Electroplating: Mechanism and Applications
- Lanfeng Guo,
- Renlong Liu,
- Zhaobo He,
- Shaoping Li,
- Tong Tan,
- Changyuan Tao
Affiliations
- Lanfeng Guo
- School of Chemistry and Chemical Engineering, Chongqing University, Chongqing, China
- Renlong Liu
- School of Chemistry and Chemical Engineering, Chongqing University, Chongqing, China
- Zhaobo He
- Hubei Sinophorus Electronic Materials Co., Ltd., Hubei, China
- Shaoping Li
- Hubei Sinophorus Electronic Materials Co., Ltd., Hubei, China
- Tong Tan
- School of Chemistry and Chemical Engineering, Chongqing University, Chongqing, China
- Changyuan Tao
- School of Chemistry and Chemical Engineering, Chongqing University, Chongqing, China
- DOI
-
https://doi.org/10.1021/acsomega.3c09548
- Journal volume & issue
-
Vol. 9,
no. 12
pp.
14092
– 14100
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