Nanoscale evolution of interface morphology during electrodeposition

Nicholas M. Schneider; Jeung Hun Park; Joseph M. Grogan; Daniel A. Steingart; Haim H. Bau; Frances M. Ross

doi:10.1038/s41467-017-02364-9

Nature Communications (Dec 2017)

Nanoscale evolution of interface morphology during electrodeposition

Nicholas M. Schneider,
Jeung Hun Park,
Joseph M. Grogan,
Daniel A. Steingart,
Haim H. Bau,
Frances M. Ross

Affiliations

Nicholas M. Schneider: Department of Mechanical Engineering and Applied Mechanics, University of Pennsylvania
Jeung Hun Park: Department of Materials Science and Engineering, University of California-Los Angeles
Joseph M. Grogan: Department of Mechanical Engineering and Applied Mechanics, University of Pennsylvania
Daniel A. Steingart: Department of Mechanical and Aerospace Engineering, Andlinger Center for Energy and the Environment, Princeton University
Haim H. Bau: Department of Mechanical Engineering and Applied Mechanics, University of Pennsylvania
Frances M. Ross: IBM T. J. Watson Research Center

DOI: https://doi.org/10.1038/s41467-017-02364-9
Journal volume & issue: Vol. 8, no. 1
pp. 1 – 10

Abstract

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Understanding structure evolution during electrochemical growth is crucial in materials processing and design of devices such as batteries. Here, the authors image copper during electrodeposition to provide strategies for controlling interface morphology.

Published in Nature Communications

ISSN: 2041-1723 (Online)
Publisher: Nature Portfolio
Country of publisher: United Kingdom
LCC subjects: Science
Website: https://www.nature.com/ncomms/

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