Analysis of Operational Characteristics of AlGaN/GaN High-Electron-Mobility Transistor with Various Slant-Gate-Based Structures: A Simulation Study

Abstract

This study investigates the operational characteristics of AlGaN/GaN high-electron-mobility transistors (HEMTs) by applying a slant-gate structure and drain-side extended field-plate (FP) for improved breakdown voltage. Prior to the analysis of slant-gate-based HEMT, simulation parameters were extracted from the measured data of fabricated basic T-gate HEMTs to secure the reliability of the results. We suggest three different types of slant-gate structures that connect the basic T-gate electrode boundary to the 1st and 2nd SiN passivation layers obliquely. To consider both the breakdown voltage and frequency characteristics, the DC and RF characteristics of various slant-gate structures including the self-heating effect were analyzed by TCAD simulation. We then applied a drain-side extended FP to further increase the breakdown voltage. The maximum breakdown voltage was achieved at the FP length of 0.4 μm. Finally, we conclude that the slant-gate structures can improve breakdown voltage by up to 66% without compromising the frequency characteristics of the HEMT. When the drain-side FP is applied to a slant-gate structure, the breakdown voltage is further improved by up to 108%, but the frequency characteristics deteriorate. Therefore, AlGaN/GaN HEMTs with an optimized slant-gate-based structure can ultimately be a promising candidate for high-power and high-frequency applications.

Keywords

• GaN
• high-electron-mobility transistor
• slant-gate
• field-plate
• breakdown voltage