The electronic components mounted on the printed circuit boards (PCBs) of mobile phones represent a resource that is rich in metals, and after separation from the boards, these components could be considered secondary raw materials. The concentrations of the valuable metals are insignificant when compared with those of complete PCBs; however, they could be significantly higher in a fraction formed from the separated components. This study focused on the analysis of Ag, Au, Cu, Nd, Nb, Ni, Pb, Pd, Sn, and Ta in fractions produced by the separation of all the components mounted on PCBs from several types of mobile phones. Atomic absorption spectrometry, atomic emission spectrometry, and mass spectrometry techniques were utilized, and a comparison of five older models of “brick” phones and five modern smartphones was conducted. Additionally, 50 kg of PCBs from the current recycling market were analyzed in the same way to create a summary of the current recycling stream.
