Energies (Oct 2021)

Insights into Partial Slips and Temperature Jumps of a Nanofluid Flow over a Stretched or Shrinking Surface

  • Ji-Huan He,
  • Nader Y. Abd Elazem

DOI
https://doi.org/10.3390/en14206691
Journal volume & issue
Vol. 14, no. 20
p. 6691

Abstract

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This paper elucidates the significance of partial slips and temperature jumps on the heat and mass transfer of a boundary layer nanofluid flowing through a stretched or shrinking surface. Considerable consideration is given to the dynamic properties of the nanofluid process, including Brownian motion and thermophoresis. A similarity transform is introduced to obtain a physical model of nonlinear ordinary differential equations, and the Chebyshev method of collocation is used to numerically analyze the influences of parameters of physical flow such as slip, temperature jump, Brownian motion, thermophoresis, suction (or injection) parameters, and Lewis and Prandtl numbers. The numerical results for temperature and concentration profiles, and heat and mass transfer rates, are graphically represented, and insights into the effects of slips and temperature jumps are revealed. In the case of a stretched sheet, the slip parameter enhances the temperature field and increases the thermal boundary layer thickness as well as the concentration function’s boundary layer thickness. When the slip parameter is raised in the case of the shrinking sheet, the dual solutions for temperature and concentration functions are reduced. For the first solution, both the temperature and concentration functions drop as the slip parameter increases, but for the second solution, both the temperature and concentration functions rise as the slip parameter increases. The discoveries have applications in a number of disciplines, including heat transfer in a solar energy collector. Glass blowing, annealing, and copper wire thinning are just a few of the technical and oilfield applications for the current problem. In high-temperature industrial applications, radiation heat transfer research is critical.

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