Development of a CMOS-Compatible Carbon Nanotube Array Transfer Method
Chun Fei Siah,
Lucas Yu Xiang Lum,
Jianxiong Wang,
Simon Chun Kiat Goh,
Chong Wei Tan,
Liangxing Hu,
Philippe Coquet,
Hong Li,
Chuan Seng Tan,
Beng Kang Tay
Affiliations
Chun Fei Siah
Centre for Micro- and Nano-Electronics (CMNE), School of Electrical and Electronic Engineering, Nanyang Technological University, 50 Nanyang Ave, Singapore 639798, Singapore
Lucas Yu Xiang Lum
Centre for Micro- and Nano-Electronics (CMNE), School of Electrical and Electronic Engineering, Nanyang Technological University, 50 Nanyang Ave, Singapore 639798, Singapore
Jianxiong Wang
CNRS-NTU-THALES Research Alliances/UMI 3288, Research Techno Plaza, 50 Nanyang Ave, Border X Block, Level 6, Singapore 637553, Singapore
Simon Chun Kiat Goh
CNRS-NTU-THALES Research Alliances/UMI 3288, Research Techno Plaza, 50 Nanyang Ave, Border X Block, Level 6, Singapore 637553, Singapore
Chong Wei Tan
Centre for Micro- and Nano-Electronics (CMNE), School of Electrical and Electronic Engineering, Nanyang Technological University, 50 Nanyang Ave, Singapore 639798, Singapore
Liangxing Hu
Centre for Micro- and Nano-Electronics (CMNE), School of Electrical and Electronic Engineering, Nanyang Technological University, 50 Nanyang Ave, Singapore 639798, Singapore
Philippe Coquet
CNRS-NTU-THALES Research Alliances/UMI 3288, Research Techno Plaza, 50 Nanyang Ave, Border X Block, Level 6, Singapore 637553, Singapore
Hong Li
CNRS-NTU-THALES Research Alliances/UMI 3288, Research Techno Plaza, 50 Nanyang Ave, Border X Block, Level 6, Singapore 637553, Singapore
Chuan Seng Tan
Centre for Micro- and Nano-Electronics (CMNE), School of Electrical and Electronic Engineering, Nanyang Technological University, 50 Nanyang Ave, Singapore 639798, Singapore
Beng Kang Tay
Centre for Micro- and Nano-Electronics (CMNE), School of Electrical and Electronic Engineering, Nanyang Technological University, 50 Nanyang Ave, Singapore 639798, Singapore
Carbon nanotubes (CNTs) have, over the years, been used in research as a promising material in electronics as a thermal interface material and as interconnects amongst other applications. However, there exist several issues preventing the widespread integration of CNTs onto device applications, e.g., high growth temperature and interfacial resistance. To overcome these issues, a complementary metal oxide semiconductor (CMOS)-compatible CNT array transfer method that electrically connects the CNT arrays to target device substrates was developed. The method separates the CNT growth and preparation steps from the target substrate. Utilizing an alignment tool with the capabilities of thermocompression enables a highly accurate transfer of CNT arrays onto designated areas with desired patterns. With this transfer process as a starting point, improvement pointers are also discussed in this paper to further improve the quality of the transferred CNTs.