Solvent-free polyurethane adhesives with excellent adhesion performance at ultra-low temperature

Abstract

Adhesives with excellent adhesion and high elongation at cryogenic temperatures are necessary for fields such as aerospace, transportation, superconductors, and medicine, but have difficult requirements. This study aimed to develop a solvent-free, two-component polyurethane (PU) adhesive with excellent adhesion and high elongation, especially in ultra-low temperature conditions. we incorporated bulky polydimethylsiloxane (PDMS) diol into the hard segment of the PU adhesive to enhance flexibility and improve physical cross-linking within the adhesive matrix. The resulting PDMS-based PU adhesive showed a tensile strength of 120 MPa at −170 °C and a high elongation of approximately 4 %. It showed a lap-shear strength of up to 13 MPa at −196 °C. Additionally, the adhesive was curable at 23 °C. In this study, the cryogenic applicability of the PU adhesive was evaluated at −170 °C (103 K, liquid natural gas) and −196 °C (77 K, liquid nitrogen). Future research on the polymer adhesive materials applicable to ultra-low temperatures, such as 20 K, may be necessary if storage and transportation of liquid hydrogen become feasible.

Keywords

• Polydimethylsiloxane (PDMS)
• PDMS-based polyurethane adhesive
• High elongation
• Lap-shear strength
• Ultra-low temperature