AIP Advances (Sep 2020)

Microstructure of YBa2Cu3Oy coated conductor using {100} ⟨001⟩ textured Cu tape with dual functions of metal substrate and electric stabilizing layer in order to develop low-cost high-TC superconducting wires

  • Ataru Ichinose,
  • Tsuyoshi Hamada,
  • Keisuke Ota,
  • Iwao Kawayama,
  • Toshiya Doi

DOI
https://doi.org/10.1063/5.0021082
Journal volume & issue
Vol. 10, no. 9
pp. 095305 – 095305-6

Abstract

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A new configuration of coated conductors (CCs), REBa2Cu3Oy (RE: rare earth elements such as Sm, Eu, Gd, and Y)/(Sr, La)TiO3 conductive buffer/Ni-electroplated {100}⟨001⟩ textured Cu and SUS316 lamination tape, has been proposed to reduce material costs. This conductive buffer layer is slightly modified from the previously reported Sr (Ti, Nb)O3 conductive buffer layers by changing the substitution element and site. However, a drastic change is found in the electric resistivity of the conductive buffer layers after oxygen annealing of YBa2Cu3Oy. The resistivity of Sr(Ti, Nb)O3 conductive buffer layers increases by more than three orders of magnitude, while the resistivity of (Sr, La)TiO3 is almost maintained and only minimally increases. Microscopic structural analysis of the CCs using the newly proposed conductive buffer layer is conducted using transmission electron microscopy (TEM). A very clean interface between the metal tape and the conductive buffer layer in the 600 nm thick (Sr, La)TiO3 buffer layers is confirmed by the TEM analysis, which has no reactive layers as well as no inter-diffusion of oxygen and metal elements. This result will soon lead to the development of low-cost and high-performance CCs.