Studies on heat transfer characteristics of vapor chamber under periodic-pulsed heat source

Abstract

In a high-power microwave device, the intense electron beam causes a high-heat-flux on the collector’s inner surface which results in an instant temperature increase which eventually causes the output power to drop. The vapor chamber is one of the passive cooling devices effective for high-heat-flux heat dissipation. To study the heat dissipation capacity and the surface temperature control effect of the vapor chamber, a numerical heat transfer model of the vapor chamber is proposed based on the effective thermal conductivity method. The accuracy of the steady-state heat transfer analysis and the applicability of the transient simulation are verified by comparing with experimental data, and the heat transfer are calculated under the condition of periodic pulsed heat sources. Lastly, the transient performance of a vapor chamber relative to a copper heat spreader of the same external dimensions is investigated as a function of the wick effective thermal conductivity, pulsed heat flux, and pulse duration. The transient behavior of the vapor chambers are examined to find a performance threshold to determine if the performance is superior to that of a copper heat spreader. The present work provides a basis to understand the advantages and limitations of metal heat spreader in pulse mode operation of vapor chamber and plays a vital role in the design of improving transient performance.