School of Electronic Science and Engineering, National Laboratory of Solid State Microstructures, Key Laboratory of Intelligent Optical Sensing and Manipulation, School of Physics, College of Engineering and Applied Sciences, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University
Kunpeng Jia
School of Electronic Science and Engineering, National Laboratory of Solid State Microstructures, Key Laboratory of Intelligent Optical Sensing and Manipulation, School of Physics, College of Engineering and Applied Sciences, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University
Guanghao Zhu
School of Electronic Science and Engineering, National Laboratory of Solid State Microstructures, Key Laboratory of Intelligent Optical Sensing and Manipulation, School of Physics, College of Engineering and Applied Sciences, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University
Hui Li
School of Electronic Science and Engineering, National Laboratory of Solid State Microstructures, Key Laboratory of Intelligent Optical Sensing and Manipulation, School of Physics, College of Engineering and Applied Sciences, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University
Yue Fei
School of Electronic Science and Engineering, National Laboratory of Solid State Microstructures, Key Laboratory of Intelligent Optical Sensing and Manipulation, School of Physics, College of Engineering and Applied Sciences, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University
Yuqing Guo
School of Electronic Science and Engineering, National Laboratory of Solid State Microstructures, Key Laboratory of Intelligent Optical Sensing and Manipulation, School of Physics, College of Engineering and Applied Sciences, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University
Hang Yuan
School of Electronic Science and Engineering, National Laboratory of Solid State Microstructures, Key Laboratory of Intelligent Optical Sensing and Manipulation, School of Physics, College of Engineering and Applied Sciences, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University
Hao Wang
School of Electronic Science and Engineering, National Laboratory of Solid State Microstructures, Key Laboratory of Intelligent Optical Sensing and Manipulation, School of Physics, College of Engineering and Applied Sciences, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University
Xiaoqing Jia
School of Electronic Science and Engineering, National Laboratory of Solid State Microstructures, Key Laboratory of Intelligent Optical Sensing and Manipulation, School of Physics, College of Engineering and Applied Sciences, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University
Qingyuan Zhao
School of Electronic Science and Engineering, National Laboratory of Solid State Microstructures, Key Laboratory of Intelligent Optical Sensing and Manipulation, School of Physics, College of Engineering and Applied Sciences, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University
Lin Kang
School of Electronic Science and Engineering, National Laboratory of Solid State Microstructures, Key Laboratory of Intelligent Optical Sensing and Manipulation, School of Physics, College of Engineering and Applied Sciences, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University
Jian Chen
School of Electronic Science and Engineering, National Laboratory of Solid State Microstructures, Key Laboratory of Intelligent Optical Sensing and Manipulation, School of Physics, College of Engineering and Applied Sciences, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University
Shi-ning Zhu
School of Electronic Science and Engineering, National Laboratory of Solid State Microstructures, Key Laboratory of Intelligent Optical Sensing and Manipulation, School of Physics, College of Engineering and Applied Sciences, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University
Peiheng Wu
School of Electronic Science and Engineering, National Laboratory of Solid State Microstructures, Key Laboratory of Intelligent Optical Sensing and Manipulation, School of Physics, College of Engineering and Applied Sciences, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University
Zhenda Xie
School of Electronic Science and Engineering, National Laboratory of Solid State Microstructures, Key Laboratory of Intelligent Optical Sensing and Manipulation, School of Physics, College of Engineering and Applied Sciences, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University
Labao Zhang
School of Electronic Science and Engineering, National Laboratory of Solid State Microstructures, Key Laboratory of Intelligent Optical Sensing and Manipulation, School of Physics, College of Engineering and Applied Sciences, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University
Abstract Fiber components form the standard not only in modern telecommunication but also for future quantum information technology. For high-performance single-photon detection, superconducting nanowire single-photon detectors (SPDs) are typically fabricated on a silicon chip and fiber-coupled for easy handling and usage. The fiber-to-chip interface hinders the SPD from being an all-fiber device for full utilization of its excellent performance. Here, we report a scheme of SPD that is directly fabricated on the fiber tip. A bury-and-planar fabrication technique is developed to improve the roughness of the substrate for all-fiber detectors’ performance for single-photon detection with amorphous molybdenum silicide (MoSi) nanowires. The low material selectivity and universal planar process enable fabrication and packaging on a large scale. Such a detector responds to a broad wavelength range from 405 nm to 1550 nm at a dark count rate of 100 cps. The relaxation time of the response pulse is ~ 15 ns, which is comparable to that of on-chip SPDs. Therefore, this device is free from fiber-to-chip coupling and easy packaging for all-fiber quantum information systems.
