Effect of water-based carrier on the properties ofcopper composite pastes

Abstract

In order to improve the rheology, surface tension, density, volatility and thermal conductivity of copper composite pastes, and thus the printing performance and conductivity, the effect of water-based carrier on the properties of the pastes was studied. Deionized water was used to replace the organic solvent in the traditional slurry and a small amount of additives were added to improve the rheological properties of the carrier liquid. The formulation of the water-based paste was designed by orthogonal experiment to investigate the effect of the additives on the properties of the water-based copper composite pastes. The micro morphology and properties of copper the pastes were observed by JSM-6700F field emission scanning electron microscope (SEM), X-ray diffraction analyzer (XRD) and FT-340 four probe resistivity testers. The results show that when the optimum ratio of water-based carrier was PEG-400∶Xanthan gum∶Tween-80∶Deionized water =1.5∶0.5∶1.0∶97.0, the film is dense, the conductive network is complete, showing excellent conductivity and micro morphology; and the resistivity is as low as 2.13×10-5 Ω·m. The water-based carrier greatly improves the printing performance and conductivity of the copper composite pastes.

Keywords

• water-based copper composite pastes
• water-based carrier
• auxiliary
• printing performance
• conductivity