Using AlN-Coated Heat Sink to Improve the Heat Dissipation of LED Packages

Abstract

This study optimizes aluminum nitride (AlN) ceramics, in order to enhance the thermal performance of light-emitting diode (LED) packages. AlN coatings are grown on copper/ aluminum substrates as a heat interface material, using an electrostatic spraying process. The effect of the deposition parameters on the coatings is determined. The thermal performance of AlN coated Cu/Al substrates is evaluated in terms of the heat dissipated and compared by measuring the LED case temperature. The structure and properties of the coating are also examined a scanning electron microscopy (SEM). In sum, the thermal performance of the LED is increased and good heat resistance characteristics are obtained. The results show that using AlN ceramic coating on a copper/aluminum substrate increases the thermal performance.