Tolerance Considerations for MHMIC Manufacturing Process at Millimeter-Wave Band

Abstract

This paper investigates the manufacturing uncertainties at a 60 GHz millimeter-wave band for the monolithic hybrid microwave integrated circuits (MHMIC) fabrication process. It specifically deals with the implementation tolerances of thin-film gold microstrip transmission lines, titanium oxide thin-layer resistors, microstrip quarter-wavelength radial stubs, and active device implementation using the gold-bonding ribbons. The impacts of these manufacturing tolerances are assessed and experimentally quantified through prototyped MHMIC circuits. This allows us, on one hand, to identify the acceptable amount of dimensional variation enabling reasonable performances. On the other hand, it aims to establish a relationship between the manufacturing tolerances and the circuit parameters to provide more flexibility for the tolerance compensation and accuracy enhancement of the MHMIC fabrication processes.

Keywords

• analysis
• accuracy
• bonding
• calibration
• error
• manufacturing