The Impact of Soft Error on C-Elements Due to Process Corner Variation and Temperature

Abstract

This paper presents current injection resemble single event upset (SEU) current at the vulnerable nodes on different configurations of C-elements under two different scenarios: process corner and temperature. The objectives are to identify the vulnerable nodes due to SEU and to find the critical charges needed to flip the output from low to high (0-1) and high to low (1-0) on different configurations of C-elements. The comparisons of C-elements in term of the resistivity toward soft error are presented.

Keywords

• Soft Error
• Process Variation
• Temperature.