Publisher Correction: Polymer-acid-metal quasi-ohmic contact for stable perovskite solar cells beyond a 20,000-hour extrapolated lifetime

• Junsheng Luo,
• Bowen Liu,
• Haomiao Yin,
• Xin Zhou,
• Mingjian Wu,
• Hongyang Shi,
• Jiyun Zhang,
• Jack Elia,
• Kaicheng Zhang,
• Jianchang Wu,
• Zhiqiang Xie,
• Chao Liu,
• Junyu Yuan,
• Zhongquan Wan,
• Thomas Heumueller,
• Larry Lüer,
• Erdmann Spiecker,
• Ning Li,
• Chunyang Jia,
• Christoph J. Brabec,
• Yicheng Zhao

Affiliations

Junsheng Luo

National Key Laboratory of Electronic Films and Integrated Devices, School of Integrated Circuit Science and Engineering, University of Electronic Science and Technology of China

Bowen Liu

Institute of Materials for Electronics and Energy Technology (i-MEET), Department of Materials Science, Friedrich-Alexander University Erlangen-Nürnberg

Haomiao Yin

National Key Laboratory of Electronic Films and Integrated Devices, School of Integrated Circuit Science and Engineering, University of Electronic Science and Technology of China

Xin Zhou

Institute of Micro- and Nanostructure Research & Center for Nanoanalysis and Electron Microscopy (CENEM), Department of Materials Science, FriedrichAlexander-Universität Erlangen-Nürnberg

Mingjian Wu

Institute of Micro- and Nanostructure Research & Center for Nanoanalysis and Electron Microscopy (CENEM), Department of Materials Science, FriedrichAlexander-Universität Erlangen-Nürnberg

Hongyang Shi

Institute of Materials for Electronics and Energy Technology (i-MEET), Department of Materials Science, Friedrich-Alexander University Erlangen-Nürnberg

Jiyun Zhang

Institute of Materials for Electronics and Energy Technology (i-MEET), Department of Materials Science, Friedrich-Alexander University Erlangen-Nürnberg

Jack Elia

Institute of Materials for Electronics and Energy Technology (i-MEET), Department of Materials Science, Friedrich-Alexander University Erlangen-Nürnberg

Kaicheng Zhang

Institute of Materials for Electronics and Energy Technology (i-MEET), Department of Materials Science, Friedrich-Alexander University Erlangen-Nürnberg

Jianchang Wu

Institute of Materials for Electronics and Energy Technology (i-MEET), Department of Materials Science, Friedrich-Alexander University Erlangen-Nürnberg

Zhiqiang Xie

Institute of Materials for Electronics and Energy Technology (i-MEET), Department of Materials Science, Friedrich-Alexander University Erlangen-Nürnberg

Chao Liu

Institute of Materials for Electronics and Energy Technology (i-MEET), Department of Materials Science, Friedrich-Alexander University Erlangen-Nürnberg

Junyu Yuan

Shenzhen Institute for Advanced Study, University of Electronic Science and Technology of China

Zhongquan Wan

National Key Laboratory of Electronic Films and Integrated Devices, School of Integrated Circuit Science and Engineering, University of Electronic Science and Technology of China

Thomas Heumueller

Institute of Materials for Electronics and Energy Technology (i-MEET), Department of Materials Science, Friedrich-Alexander University Erlangen-Nürnberg

Larry Lüer

Institute of Materials for Electronics and Energy Technology (i-MEET), Department of Materials Science, Friedrich-Alexander University Erlangen-Nürnberg

Erdmann Spiecker

Institute of Micro- and Nanostructure Research & Center for Nanoanalysis and Electron Microscopy (CENEM), Department of Materials Science, FriedrichAlexander-Universität Erlangen-Nürnberg

Ning Li

Institute of Materials for Electronics and Energy Technology (i-MEET), Department of Materials Science, Friedrich-Alexander University Erlangen-Nürnberg

Chunyang Jia

National Key Laboratory of Electronic Films and Integrated Devices, School of Integrated Circuit Science and Engineering, University of Electronic Science and Technology of China

Christoph J. Brabec

Institute of Materials for Electronics and Energy Technology (i-MEET), Department of Materials Science, Friedrich-Alexander University Erlangen-Nürnberg

Yicheng Zhao

National Key Laboratory of Electronic Films and Integrated Devices, School of Integrated Circuit Science and Engineering, University of Electronic Science and Technology of China