Numerical modeling and sensitivity analysis of the thermal behavior of an underfloor heating system using COMSOL Multiphysics software

Abstract

Due to their many advantages over conventional heating systems, underfloor heating systems have seen an increase in their use, particularly in the residential, commercial, and industrial sectors. The main objective of this work is to carry out a parametric study to predict the thermal behavior of various heating floor construction type, such as homogeneous floor, single layer floor and double layer floors, under the variation of several construction and operation parameters, using a numerical simulator for the three-dimensional calculation in a transient state. The results obtained by numerical simulation show that the supply water temperature, the type and thickness of the floor covering are among the parameters that have a significant effect on the level of thermal comfort. Moreover, the insertion of an insulation layer below the heating circuit provides both thermal and acoustic insulation.