IEEE Access (Jan 2020)

Compact Mode Division MUX/DEMUX Using Enhanced Evanescent-Wave Coupling on Silicon-on-Insulator (SOI) Platform for 11-Tbit/s Broadband Transmission

  • Guan-Hong Chen,
  • Jui-Feng Tsai,
  • Ching-Wei Peng,
  • Pin-Cheng Kuo,
  • Chun-Jui Chen,
  • Chi-Wai Chow,
  • Chien-Hung Yeh,
  • Yinchieh Lai,
  • Yang Liu

DOI
https://doi.org/10.1109/ACCESS.2020.3041418
Journal volume & issue
Vol. 8
pp. 219881 – 219890

Abstract

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Mode-division-multiplexing (MDM) can increase the total on-chip transmission capacity. Silicon-on-insulator (SOI) based MDM multiplexer (MUX) and demultiplexer (DEMUX) using asymmetrical directional couplers (ADCs) are promising; however, they usually require long coupling lengths for mode conversion. Here, for the first time up to the authors' knowledge, we propose, simulate, fabricate and demonstrate a size reduced SOI based $4 \times 4$ MDM MUX and DEMUX using enhanced evanescent-wave coupling (EEC). Here, we illustrate by experiments and numerically analyses that by size reducing the ADC access coupling region, evanescent-wave coupling is enhanced. Significant coupling length reduction of ~80 % can be achieved, while similar MDM MUX and DEMUX performance can be observed. To experimentally evaluate the broadband and high-speed transmission operations of the proposed device, 48 wavelength channels each modulated by >60 Gbit/s orthogonal frequency division multiplexing (OFDM) signals are successfully mode multiplexed and demultiplexed, achieving a transmission capacity of 11.73 Tbit/s.

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