AIP Advances (Aug 2021)

Monolithically integrated InGaAs/AlGaAs multiple quantum well photodetectors on 300 mm Si wafers

  • H. Mehdi,
  • M. Martin,
  • C. Jany,
  • L. Virot,
  • J. M. Hartmann,
  • J. Da Fonseca,
  • J. Moeyaert,
  • P. Gaillard,
  • J. Coignus,
  • C. Leroux,
  • C. Licitra,
  • B. Salem,
  • T. Baron

DOI
https://doi.org/10.1063/5.0059237
Journal volume & issue
Vol. 11, no. 8
pp. 085028 – 085028-7

Abstract

Read online

Near infrared light detection is fundamental for sensing in various application fields. In this paper, we detail the properties of InGaAs/AlGaAs multiple quantum well (MQW) photodetectors (PDs) monolithically integrated by direct epitaxy on 300 mm Si(001) substrates. A MQW high crystalline quality is achieved using 300 mm Ge/Si pseudo-substrates with a low threading dislocation density of 4 × 107 cm−2 from electron channeling contrast imaging measurements. The localized states in the MQW stack are investigated using temperature-dependent photoluminescence. Two non-radiative recombination channels are identified. The first one is due to delocalized excitons generated by potential’s fluctuations because of the InGaAs/AlGaAs interfacial roughness (with an activation energy below 4 meV). The second one is due to exciton quenching because of the presence of numerous threading dislocations. A low dark current density of 2.5 × 10−5 A/cm2 is measured for PDs on Ge/Si substrates, i.e., a value very close to that of the same PDs grown directly on GaAs(001) substrates. A responsivity of 36 mA/W is otherwise measured for the photodiode on Ge/Si at room temperature and at −2 V.