Structural Design and Tailoring of Composites to Obtain near Zero Coefficient of Linear Thermal Expansion

Abstract

The paper discusses the realization of high dimensional stability of products, including minimization of thermal strains by the use of additives having negative coefficient of linear thermal expansion, as well as auxetics having negative Poisson’s ratio. Mechanisms of change of thermal stress state of the porous, dispersion-reinforced and layered materials are established during heating and cooling, depending on elasticity moduli, the size of inclusions, a parity of rigidity of the matrix and the filler as well as boundary conditions. The results of structural design make it possible to improve dimensional stability and reduce residual stresses of microelectronics elements, precise equipment for aerospace engineering and measuring instruments.

Keywords

• measuring instrument
• microelectronics elements
• functional materials
• aluminum alloys
• auxetics
• zirconium tungstate
• thermal expansion
• residual stresses
• finite element analysis