Kinetic Analysis of Mica Tape Curing Process

Abstract

Curing program of thermoset insulating materials and its responsible setting has the key importance for assurance of high quality and reliability of electrical devices. It is possible to determine parameters of this program (temperature and time of curing) by several ways in practise. There is mostly focused on methods based on kinetic analysis. The result comparison of selected methods of kinetic analysis and residual enthalpy measurement is the main aim of the paper. Two insulating tapes were chosen for the purpose of this study. These tapes correspond in their composition (glass fabric, mica and epoxy binder), but they differ in curing agent type. Simultaneous thermal analysis (STA) was used during the measurements. Monitored results demonstrate the advantages and disadvantages of particular methods.

Keywords

• kinetic analysis
• particular methods
• electrical devices.