Heat management of LED-based Cu2O deposits on the optimal structure of heat sink

Abstract

This report investigates the thermal performance of light-emitting diodes (LEDs) using a heat sink structure based on an optimized design and a sprayed cuprous oxide (Cu2O) coating. An orthogonal array of 18 aluminum plates with various heat-dissipated structures was created. The optimal junction temperature of the LED package is determined by using the signal-to-noise ratio (S/N) of the heat-dissipated structure based on Taguchi’s method as well as the heat dissipation coating. According to the analysis of variance, the most important factors that influence the junction temperature can be obtained as the depth of groove, the layout of holes, the layout of LEDs, and the number of Cu block. These significant factors constituted approximately 91.06% of the variation in the experiment. The results show that by optimizing the structure of the LED heat sink based on the heat-dissipated coating, the efficiency of the junction temperature is increased by 23.88%. Also, a gain of 1.30 dB corresponds to a 9.67% reduction in variance, which indicates the improvement through the optimal setting by 1.162 times of variance, showing good reproducibility. Overall, the coating is based on the optimized design of the structure of the heat sink that has good heat transfer capability, which can provide a good solution to the heat-dissipated problem of LED and further give guidance to the future development of LED.

Keywords

• led assembly
• cu2o
• junction temperature
• heat-dissipated structure
• electrostatic spraying