Advances in Mechanical Engineering (Oct 2020)

Numerical stress analysis in adhesively bonded joints under thermo-mechanical loading

  • Nawres J Al-Ramahi,
  • Roberts Joffe,
  • Janis Varna

DOI
https://doi.org/10.1177/1687814020955072
Journal volume & issue
Vol. 12

Abstract

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The objective of this work is to evaluate the effect of residual thermal stresses, arising after assembling a single-lap joint at elevated temperature, on the inelastic thermo-mechanical stress state in the adhesive layer. The numerical analysis (FEM) employing linear and non-linear material models, with geometrical nonlinearity accounted for, is carried out. Simulating the mechanical response, the calculated thermal stresses are assigned as initial conditions to polymeric, composite and metallic joint members to reflect the loading sequence where the mechanical strain is applied to cooled-down structure. It is shown that the sequence of application matters and simulations with simultaneous application of temperature and strain give different result. Two scenarios for adhesive joints with composites are studied: joining by adhesive curing of already cured composite parts (two-step process) and curing the adhesive and the composite simultaneously in one-step (co-curing). Results show that while in-plane stresses in the adhesive are higher, the peaks of out-of-plane shear stress and peel stress (most responsible for the joint failure) at the end of the overlap are reduced due to thermal effects. In joints containing composite parts, the one-step joining scenario is more favorable than the two-step. The ply stacking sequence in the composite has significant effect on stress concentrations as well as on the plateau value of the shear stress in the adhesive.