Solution-processable 2D materials for monolithic 3D memory-sensing-computing platforms: opportunities and challenges

Baoshan Tang; Maheswari Sivan; Jin Feng Leong; Zefeng Xu; Yu Zhang; Jianan Li; Ruyue Wan; Quanzhen Wan; Evgeny Zamburg; Aaron V-Y Thean

doi:10.1038/s41699-024-00508-2

npj 2D Materials and Applications (Nov 2024)

Solution-processable 2D materials for monolithic 3D memory-sensing-computing platforms: opportunities and challenges

Baoshan Tang,
Maheswari Sivan,
Jin Feng Leong,
Zefeng Xu,
Yu Zhang,
Jianan Li,
Ruyue Wan,
Quanzhen Wan,
Evgeny Zamburg,
Aaron V-Y Thean

Affiliations

Baoshan Tang: Department of Electrical and Computer Engineering, National University of Singapore, 4 Engineering Drive 3
Maheswari Sivan: Department of Electrical and Computer Engineering, National University of Singapore, 4 Engineering Drive 3
Jin Feng Leong: Department of Electrical and Computer Engineering, National University of Singapore, 4 Engineering Drive 3
Zefeng Xu: Department of Electrical and Computer Engineering, National University of Singapore, 4 Engineering Drive 3
Yu Zhang: Department of Electrical and Computer Engineering, National University of Singapore, 4 Engineering Drive 3
Jianan Li: Department of Electrical and Computer Engineering, National University of Singapore, 4 Engineering Drive 3
Ruyue Wan: Department of Electrical and Computer Engineering, National University of Singapore, 4 Engineering Drive 3
Quanzhen Wan: Department of Electrical and Computer Engineering, National University of Singapore, 4 Engineering Drive 3
Evgeny Zamburg: Department of Electrical and Computer Engineering, National University of Singapore, 4 Engineering Drive 3
Aaron V-Y Thean: Department of Electrical and Computer Engineering, National University of Singapore, 4 Engineering Drive 3

DOI: https://doi.org/10.1038/s41699-024-00508-2
Journal volume & issue: Vol. 8, no. 1
pp. 1 – 30

Abstract

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Abstract Solution-processable 2D materials (2DMs) are gaining attention for applications in logic, memory, and sensing devices. This review surveys recent advancements in memristors, transistors, and sensors using 2DMs, focusing on their charge transport mechanisms and integration into silicon CMOS platforms. We highlight key challenges posed by the material’s nanosheet morphology and defect dynamics and discuss future potential for monolithic 3D integration with CMOS technology.

Published in npj 2D Materials and Applications

ISSN: 2397-7132 (Online)
Publisher: Nature Portfolio
Country of publisher: United Kingdom
LCC subjects: Technology: Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials; Science: Chemistry
Website: https://www.nature.com/npj2dmaterials/

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