STUDY OF SILICON-INSULATOR STRUCTURE DEFECTS BASED ON ANALYSIS OF A SPATIAL DISTRIBUTION OF A SEMICONDUCTOR WAFERS’ SURFACE POTENTIAL

Abstract

The matter of the study is application of contact potential difference and band bending visualization technique based on Kelvin–Ziesman technique to the non-destructive testing and defects study of a silicon-insulator structure. Experiments were held using a thermally oxidized boron-doped silicon wafer. Visualized defect distribution map is in a good agreement with a preliminary data on defectproducing factors. Results compared to ellipsometry data show that CPD visualization data is not influenced by presence and thickness of insulating layer.

Keywords

• surface potential
• kelvin–ziesman technique
• silicon-insulator structure
• non-destructive testing
• semiconductor wafer defects