Mass analysis of the components separated from printed circuit boards

Abstract

Methods of effective and ecological recycling of printed circuit boards (PCBs) are searched all over the world at this time.The material composition and temperature properties of PCB are necessary to be known for an optimal recycling technology. For thispurpose we analyzed weight ratio of the electronic components moulded on the selected kinds of PCBs and next we formulatedmathematic model of temperature field in PCB during a grinding process in that the metal layers are separated from the plasticelements. We present the obtained results in this paper.

Keywords

• Mass analysis
• printed circuit board
• electronic components
• recycling
• model