Simulation of Dynamic Recrystallization Behavior under Hot Isothermal Compressions for as-extruded 3Cr20Ni10W2 Heat-Resistant Alloy by Cellular Automaton Model

Abstract

In order to study dynamic recrystallization behavior of the as-extruded 3Cr20Ni10W2 under isothermal compression conditions, a cellular automaton (CA) model was applied to simulate hot compression. Analysis on the strain–stress curves indicates that dynamic recrystallization is the main softening mechanism for the 3Cr20Ni10W2 when the deformation occurred in the temperature range of 1203–1303 K with an interval of 50 K and strain rate range of 0.01–10 s−1. The deformation temperature and strain rate have a significant influence on the dynamically recrystallized grain size. Subsequently, a CA model is established to simulate the dynamic recrystallization behaviors of the studied alloy. The simulated results show that the mean grain size increases with the increased deformation temperature and decreases with the increased strain rate, which is consistent with the experimental result. In addition, the average absolute relative error, which is 13.14%, indicates that the process of the dynamic recrystallization and the dynamically recrystallized grain size can be well predicted by the present CA model.

Keywords

• 3cr20ni10w2
• cellular automaton
• dynamic recrystallization
• recrystallized grain size