Simulation of cooling system using internal air flow with bending flow passages

Abstract

Cooling after the implementation of a high-density integrated circuit manufacturing process using internal air flow within the object to be cooled is often performed in the industry. In this study, the cooling performance is predicted using a numerical simulation model and examined by the experiment when the flow rate is within 30 L/min (ANR). Three types of flow passage shapes are made with the plate size of 13.4 mm × 13.1 mm and cooling performances are compared with each other. As a result, it was confirmed that the cooling time reduced when the number of turns in the flow passage was increased and the cooling efficiency reduced when the number of turns in the flow passage was increased. It is considered that the cooling system using a flow passage with four turns is the optimal system for practical use.