Contact connections in electronic printing circuit, performed using the foil puncture method

Abstract

The results of theoretical and experimental researches of the unsoldered contact connections performed using the foil puncture method are demonstrated. The structural parameters of printing circuit boards and contacts of electronic components from positions of microminiatu-rization of electronic apparatus are determined. The contact connections are tested on climatic and mechanical factors influence, and the durability of contacts of electronic components is measured for ensuring of their pressing.

Keywords

• printed circuit board
• electronic components leads
• cold joints