Characterization and storage study of chickpea flour films with UV-barrier and Cu-remove properties

Abstract

An important challenge to food industries is the stability of oxidation-sensitive compounds in packaged foods. In this study, we developed an eco-friendly chickpea flour film (CFF) as an innovative active food packaging material. We investigated the functional properties of films, its copper removal activity and UV-barrier properties during 90 days of storage. The water vapor permeability (1.35 × 10−11 gm−1s−1Pa−1), water content (17.50%) and solubility (35.15%), optical and mechanical properties of chickpea flour films were comparable to that of other bio-based films. The properties of CFF did not change during storage. CFF had UV-light shielding behavior and copper-removal capacity. CFF blocked more than the 95% of the UV spectrum. Maximum Cu-removal capacity (∼ 99.5%) was no affected by the concentrations of copper ions studied. The adsorption data fitted the Langmuir adsorption model, suggesting monolayer coverage. These found properties and eco-friendliness endow the chickpea flour films with great application potential as active packaging film to protect foods against UV radiation and copper promoted oxidative degradation.

Keywords

• chickpea flour
• film
• active packaging
• UV-protective
• copper removal