Thermal Analysis to Achieve Low Temperature with Thermoelectric Cooling System

Abstract

Thermoelectric coolers (TEC) are devices that conversion of electrical power into a temperature gradient. TEC modules have the benefits of high dependability, small dimensions, lightweight, absence of mechanical moving parts and working fluid. Thermoelectric cooling systems have experienced significant utilisation in recent years. These technologies have been used in automobiles to cool and maintain the quality of goods during transportation and in portable cooling bags, computers, and medical apparatus. The TEC manufacture datasheet only offers limited data on characteristics and maximum parameters, which is insufficient for studying thermoelectric systems. This paper presents an analytical modelling methodology that provides a direct method for assessing the performance of module parameters and determining the fundamental thermal physical parameters of a TEC. Furthermore, this article outlines the procedure for choosing the appropriate TEC module from a selection of three options to integrate it with a vapour compression refrigeration (VCR) system. The objective is to attain low temperatures while reducing power consumption and improving performance. The findings indicates that The TEC1-12706 module was the most suitable option among three different types of TEC modules for integration with the VCR system to achieve low temperatures. This choice was based on its lower power consumption than the TEC127010 and TEC127015 modules, resulting in 36.5% and 59.3% energy savings, respectively. Additionally, the heat dissipation from the hot side of the TEC12706 is lower than the TEC12710 and TEC12715 modules by 32.2% and 59%, respectively.

Keywords

• Thermoelectric cooler; mathematical modelling; Seebeck effect; Peltier effect; thermoelectric cooling systems