Microwave hybrid heating for lead-free solder: A review

Abstract

This paper aims to focus on the current developments of Microwave Hybrid Heating (MHH) as a promising alternative method in soldering, characterization of solder joint properties related to the MHH and comparison with the conventional methods. A brief introduction to conventional heating, microwave heating and the concept of MHH in soldering is described in the earlier topic of this review. Further investigation on wettability, phase, and structural evaluation, interfacial intermetallic compounds (IMC) morphology, and tensile properties are presented and discussed in parallel with previous work (in the last decade) and the current works. The essential value of this review is to provide an in-depth understanding of MHH for an alternative soldering approach by compiling all the most recent research, technical setup, and key discoveries. This helps the electronic packaging sector, which is dealing with difficulties in meeting the growing demands for downsizing and adding multifunctionality in a single electronic device. Hence, any necessary advancement in this sector will help in future efforts to advance the soldering industry.

Keywords

• Solder reflow
• Microwave hybrid heating
• Susceptor
• Solder joints