Enhanced thermal conductivity of epoxy composites filled with silicon carbide nanowires

Dianyu Shen; Zhaolin Zhan; Zhiduo Liu; Yong Cao; Li Zhou; Yuanli Liu; Wen Dai; Kazuhito Nishimura; Chaoyang Li; Cheng-Te Lin; Nan Jiang; Jinhong Yu

doi:10.1038/s41598-017-02929-0

Scientific Reports (Jun 2017)

Enhanced thermal conductivity of epoxy composites filled with silicon carbide nanowires

Dianyu Shen,
Zhaolin Zhan,
Zhiduo Liu,
Yong Cao,
Li Zhou,
Yuanli Liu,
Wen Dai,
Kazuhito Nishimura,
Chaoyang Li,
Cheng-Te Lin,
Nan Jiang,
Jinhong Yu

Affiliations

Dianyu Shen: Faculty of Materials Science and Engineering, Kunming University of Science and Technology
Zhaolin Zhan: Faculty of Materials Science and Engineering, Kunming University of Science and Technology
Zhiduo Liu: Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences
Yong Cao: Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences
Li Zhou: College of Materials Science and Engineering, Guilin University of Technology
Yuanli Liu: College of Materials Science and Engineering, Guilin University of Technology
Wen Dai: Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences
Kazuhito Nishimura: Advanced Nano-processing Engineering Lab, Mechanical Systems Engineering, Kogakuin University
Chaoyang Li: Research Institute & School of Systems Engineering, Kochi University of Technology
Cheng-Te Lin: Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences
Nan Jiang: Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences
Jinhong Yu: Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences

DOI: https://doi.org/10.1038/s41598-017-02929-0
Journal volume & issue: Vol. 7, no. 1
pp. 1 – 11

Abstract

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Abstract In this study, we report a facile approach to fabricate epoxy composite incorporated with silicon carbide nanowires (SiC NWs). The thermal conductivity of epoxy/SiC NWs composites was thoroughly investigated. The thermal conductivity of epoxy/SiC NWs composites with 3.0 wt% filler reached 0.449 Wm−1 K−1, approximately a 106% enhancement as compared to neat epoxy. In contrast, the same mass fraction of silicon carbide micron particles (SiC MPs) incorporated into epoxy matrix showed less improvement on thermal conduction properties. This is attributed to the formation of effective heat conduction pathways among SiC NWs as well as a strong interaction between the nanowires and epoxy matrix. In addition, the thermal properties of epoxy/SiC NWs composites were also improved. These results demonstrate that we developed a novel approach to enhance the thermal conductivity of the polymer composites which meet the requirement for the rapid development of the electronic devices.

Published in Scientific Reports

ISSN: 2045-2322 (Online)
Publisher: Nature Portfolio
Country of publisher: United Kingdom
LCC subjects: Medicine; Science
Website: https://www.nature.com/srep/

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