We present a novel design approach for the power optimization of cantilever-based shape memory alloy (SMA)/Si bimorph microactuators as well as their microfabrication and in situ characterization. A major concern upon the miniaturization of SMA/Si bimorph microactuators in conventional double-beam cantilever designs is that direct Joule heating generates a large size-dependent temperature gradient along the length of the cantilevers, which significantly enhances the critical electrical power required to complete phase transformation. We demonstrate that this disadvantage can be mitigated by the finite element simulation-assisted design of additional folded beams in the perpendicular direction to the active cantilever beams, resulting in temperature homogenization. This approach is investigated for TiNiHf/Si microactuators with a film thickness ratio of 440 nm/2 µm, cantilever beam length of 75–100 µm and widths of 3–5 µm. Temperature-homogenized SMA/Si microactuators show a reduction in power consumption of up to 48% compared to the conventional double-beam cantilever design.
